Cu–Cu Bond Quality Enhancement Through the Inclusion of a...

IEEE Transactions on Electron Devices 2013 / 04 Vol. 60; Iss. 4

Cu–Cu Bond Quality Enhancement Through the Inclusion of a Hermetic Seal for 3-D IC

Peng, Lan, Zhang, Lin, Li, Hong Yu, Tan, Chuan Seng
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Volume:
60
Language:
english
Journal:
IEEE Transactions on Electron Devices
DOI:
10.1109/TED.2013.2248368
Date:
April, 2013
File:
PDF, 1.04 MB
english, 2013
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