Micromolding of NiFe and Ni Thick Films for 3D Integration...

Journal of The Electrochemical Society 2013 / 11 Vol. 161; Iss. 2

Micromolding of NiFe and Ni Thick Films for 3D Integration of MEMS

Cortes, M., Moulin, J., Couty, M., Peng, T., Garel, O., Dinh, T. H. N., Zhu, Y., Souadda, M., Woytasik, M., Lefeuvre, E.
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Volume:
161
Language:
english
Journal:
Journal of the Electrochemical Society
DOI:
10.1149/2.006402jes
Date:
November, 2013
File:
PDF, 43 KB
english, 2013
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