Effects of Aging on Interfacial Microstructure and Reliability Between SnAgCu Solder and FeNi/Cu UBM
Qing-Sheng Zhu, Jian-Jun Guo, Pan-Ju Shang, Zhong-Guang Wang, Jian-Ku ShangVolume:
12
Year:
2010
Language:
english
Pages:
7
DOI:
10.1002/adem.200900294
File:
PDF, 1.49 MB
english, 2010