Interfacial microstructure and its effect on thermal conductivity of SiCp/Cu composites
Chen, Guoqin, Yang, Wenshu, Dong, Ronghua, Hussain, Murid, Wu, GaohuiVolume:
63
Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2014.05.068
Date:
November, 2014
File:
PDF, 1.90 MB
english, 2014