Peeling model of dielectric film including low-k material...

Microelectronic Engineering 2014 / 10 Vol. 128

Peeling model of dielectric film including low-k material on wafer edge

Sato, Nobuyoshi
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Volume:
128
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2014.05.034
Date:
October, 2014
File:
PDF, 1.42 MB
english, 2014
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