Investigation of electromigration reliability of...

Microelectronics Reliability 2014 / 11 Vol. 54; Iss. 11

Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages

Kao, Chin-Li, Chen, Tei-Chen, Lai, Yi-Shao, Chiu, Ying-Ta
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Volume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.04.014
Date:
November, 2014
File:
PDF, 2.86 MB
english, 2014
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