Effect of layout on electromigration characteristics in...

Microelectronic Engineering 2014 / 10 Vol. 128

Effect of layout on electromigration characteristics in copper dual damascene interconnects

Cheng, Y.L., Chang, Y.M., Leu, Jihperng, Bo, T.C., Wang, Y.L.
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Volume:
128
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2014.05.036
Date:
October, 2014
File:
PDF, 1.29 MB
english, 2014
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