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Electroless Deposition of Ni–Sn–P and Ni–Sn–Cu–P Coatings
Georgieva, J., Kawashima, S., Armyanov, S., Valova, E., Hubin, A., Koyama, Y., Steenhaut, O., Haydu, J., Delplancke, J.-L., Tsacheva, Ts.Volume:
152
Year:
2005
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2050467
File:
PDF, 1.84 MB
english, 2005