Novel Strain Relief Design for Multilayer Thin Film...

IEEE Transactions on Electron Devices 2013 / 07 Vol. 60; Iss. 7

Novel Strain Relief Design for Multilayer Thin Film Stretchable Interconnects

Hsu, Yung-Yu, Lucas, Kylie, Davis, Dan, Elolampi, Brian, Ghaffari, Roozbeh, Rafferty, Conor, Dowling, Kevin
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Volume:
60
Language:
english
Journal:
IEEE Transactions on Electron Devices
DOI:
10.1109/TED.2013.2264217
Date:
July, 2013
File:
PDF, 2.52 MB
english, 2013
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