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[IEEE 2010 IEEE 14th Workshop on Signal Propagation on Interconnects - Hildesheim, Germany (2010.05.9-2010.05.12)] 2010 IEEE 14th Workshop on Signal Propagation on Interconnects - Characterization and modeling of RF substrate coupling effects due to vertical interconnects in 3D integrated circuit stacking
Eid, E., Lacrevaz, T., Bermond, C., de Rivaz, S., Capraro, S., Roullard, J., Cadix, L., Flechet, B., Farcy, A., Ancey, P., Calmon, F., Valorge, O., Leduc, P.Year:
2010
Language:
english
DOI:
10.1109/SPI.2010.5483585
File:
PDF, 2.19 MB
english, 2010