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[IEEE 2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) (Formerly known as SOI Conference) - Monterey, CA, USA (2013.10.7-2013.10.10)] 2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) - Three-dimensional wafer stacking using Cu TSV integrated with 45nm high performance SOI-CMOS embedded DRAM technology
Batra, Pooja, LaTulipe, Douglas, Skordas, Spyridon, Winstel, Kevin, Kothandaraman, Chandrasekharan, Himmel, Ben, Maier, Gary, He, Bishan, Gamage, Deepal Wehella, Golz, John, Lin, Wei, Vo, Tuan, PriyadYear:
2013
Language:
english
DOI:
10.1109/S3S.2013.6716515
File:
PDF, 589 KB
english, 2013