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[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Towards efficient and reliable 300mm 3D technology for wide I/O interconnects
Coudrain, P., Colonna, J.-P, Aumont, C., Garnier, G., Chausse, P., Segaud, R., Vial, K., Jouve, A., Mourier, T., Magis, T., Besson, P., Gabette, L., Brunet-Manquat, C., Allouti, N., Laviron, C., CheraYear:
2012
Language:
english
DOI:
10.1109/EPTC.2012.6507102
File:
PDF, 2.14 MB
english, 2012