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[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - Low damage ashing using H/sub 2//He plasma for porous ultra low-k
Matsushita, A., Ohashi, N., Inukai, K., Shin, H.J., Sone, S., Sudou, K., Misawa, K., Matsumoto, I., Kobayashi, N.Year:
2003
Language:
english
DOI:
10.1109/IITC.2003.1219737
File:
PDF, 194 KB
english, 2003