[IEEE 2011 IEEE 13th Electronics Packaging Technology...

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[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Numerical simulations of forced convection in novel cylindrical oblique-finned heat sink

Yan Fan,, Lee, Poh Seng, Liwen Jin,, Beng Wah Chua,
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Year:
2011
Language:
english
DOI:
10.1109/EPTC.2011.6184499
File:
PDF, 1.42 MB
english, 2011
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