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Reliability improvement of aluminium-based contact and interconnect systems for VLSI applications by grain structure modification
T Streil, B Sauer, K Frommhagen, Ch Kunath, P Huebler, M KotzerkeVolume:
18
Year:
1992
Language:
english
Pages:
5
DOI:
10.1016/0167-9317(92)90132-b
File:
PDF, 631 KB
english, 1992