Fabrication of via-holes in multi-chip module using third...

Applied Surface Science 1993 Vol. 64; Iss. 4

Fabrication of via-holes in multi-chip module using third harmonic generation of Nd: YAG laser

Eishi Gofuku, Toshio Ohnawa, Mitsuyuki Takada, Fumio Matsukawa, Masahiro Nunoshita
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Volume:
64
Year:
1993
Language:
english
Pages:
8
DOI:
10.1016/0169-4332(93)90205-p
File:
PDF, 976 KB
english, 1993
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