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Inter-metal dielectric planarization process for 0.35 μm multilevel interconnection devices
M. Bacchetta, C. Zaccherini, L. ZanottiVolume:
91
Year:
1995
Language:
english
Pages:
7
DOI:
10.1016/0169-4332(95)00148-4
File:
PDF, 1.14 MB
english, 1995