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Tensile properties of Cu/Sn–58Bi/Cu soldered joints subjected to isothermal aging
Yu, Xiao, Hu, Xiaowu, Li, Yulong, Liu, Teng, Zhang, Ruhua, Min, ZhixianVolume:
25
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-014-1883-5
Date:
June, 2014
File:
PDF, 2.92 MB
english, 2014