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Fluxless bonding of Si chips to aluminum boards using electroplated Sn solder
Hsu, Shou-Jen, Sha, Chu-Hsuan, Lee, Chin C.Volume:
25
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-014-2014-z
Date:
August, 2014
File:
PDF, 4.29 MB
english, 2014