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Effect of hold time on the mechanical fatigue failure behavior of lead-free solder joint under high temperature
Zhu, Yongxin, Li, Xiaoyan, Gao, Ruiting, Wang, ChaoVolume:
25
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-014-2100-2
Date:
September, 2014
File:
PDF, 1.13 MB
english, 2014