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A Method for Quantification of the Effects of Size and Geometry on the Microstructure of Miniature Interconnects
Xiong, Hua, Huang, Zhiheng, Conway, PaulVolume:
43
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-013-2907-2
Date:
February, 2014
File:
PDF, 1.01 MB
english, 2014