Assessment of Tertiary Dendritic Growth and Its Effects on Mechanical Properties of Directionally Solidified Sn-0.7Cu-xAg Solder Alloys
Spinelli, José Eduardo, Silva, Bismarck Luiz, Garcia, AmauriVolume:
43
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-014-3087-4
Date:
May, 2014
File:
PDF, 7.93 MB
english, 2014