Au-In-based Hermetic Sealing for MEMS Packaging for...

Journal of Electronic Materials 2014 / 07 Vol. 43; Iss. 7

Au-In-based Hermetic Sealing for MEMS Packaging for Down-Hole Application

Chidambaram, Vivek, Bangtao, Chen, Lip, Gan Chee, Rhee Min Woo, Daniel
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Volume:
43
Language:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-014-3131-4
Date:
July, 2014
File:
PDF, 1.01 MB
english, 2014
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