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Computed-Tomography-Based Analysis of Voids in SnBi57Ag1 Solder Joints and Their Influence on the Reliability
Rauer, Miriam, Volkert, Antje, Schreck, Timo, Härter, Stefan, Kaloudis, MichaelVolume:
14
Language:
english
Journal:
Journal of Failure Analysis and Prevention
DOI:
10.1007/s11668-014-9801-y
Date:
June, 2014
File:
PDF, 2.49 MB
english, 2014