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Effect of a high-temperature pre-bake treatment on whisker formation under various thermal and humidity conditions for electrodeposited tin films on copper substrates
Na, Seong-Hun, Lee, Mi-Ri, Park, Hwa-Sun, Kim, Heung-Kyu, Suh, Su-JeongVolume:
20
Language:
english
Journal:
Metals and Materials International
DOI:
10.1007/s12540-014-2016-7
Date:
March, 2014
File:
PDF, 1.48 MB
english, 2014