Interface microstructure evolution and bonding strength of...

Interface microstructure evolution and bonding strength of TC11/γ-TiAl bi-materials fabricated by laser powder deposition

Xu, Zhi-Jun, Zhang, Yong-Zhong, Liu, Ming-Kun, Gong, Xin-Yong
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Volume:
35
Language:
english
Journal:
Rare Metals
DOI:
10.1007/s12598-014-0243-1
Date:
June, 2016
File:
PDF, 1.98 MB
english, 2016
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