Analysis of the electrical characteristics and structure of Cu-Filled TSV with thermal shock test
Jeong, Il Ho, Roh, Myong Hoon, Jung, Flora, Song, Wan Ho, Mayer, Michael, Jung, Jae PilVolume:
10
Language:
english
Journal:
Electronic Materials Letters
DOI:
10.1007/s13391-013-3260-6
Date:
May, 2014
File:
PDF, 434 KB
english, 2014