[IEEE 2007 8th International Conference on Electronic Packaging Technology - Shanghai, China (2007.08.14-2007.08.17)] 2007 8th International Conference on Electronic Packaging Technology - Local Melting and Formation Steps of Solder Bumps via Induction Heating Reflow
Xu, Hongbo, Li, Mingyu, Cheng, Gang, Kim, Jongmyung, Kim, DaewonYear:
2007
Language:
english
DOI:
10.1109/icept.2007.4441385
File:
PDF, 1.59 MB
english, 2007