IEEE Transactions on Components Packaging and Manufacturing Technology Part B
1996 / Nov. Vol. 19; Iss. 4
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Low-cost flip-chip on board
Baggerman, A.F.J., Caers, J.F.J.M., Wondergem, J.J., Wagemans, A.G.Volume:
19
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.544364
Date:
January, 1996
File:
PDF, 1.56 MB
english, 1996