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[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - A small flat-plate vapor chamber fabricated by copper powder sintering and diffusion bonding for cooling electronic packages
Hu, Run, Guo, Tinghui, Zhu, Xiaolei, Liu, Sheng, Luo, XiaobingYear:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575901
File:
PDF, 842 KB
english, 2013