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[IEEE 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (9-12 March 1997)] Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Plastic packaging modeling and characterization at RF/microwave frequencies
Raid, S.M., Su, W., Salama, I., Elshabini-Riad, A., Rachlin, M., Baker, W., Perdue, J.Year:
1997
Language:
english
DOI:
10.1109/isapm.1997.581280
File:
PDF, 108 KB
english, 1997