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[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Assessing Au-Al wire bond reliability using integrated stress sensors
McCracken, Michael J., Kim, Hyoung Joon, Mayer, Michael, Persic, John, Hwang, June Sub, Moon, Jeong-TakYear:
2010
Language:
english
DOI:
10.1109/itherm.2010.5501278
File:
PDF, 738 KB
english, 2010