[IEEE Advances in Electronic Materials and Packaging 2001 - Jeju Island, South Korea (19-22 Nov. 2001)] Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) - Adaptation of neural network and application of digital ultrasonic image processing for the pattern recognition of defects in semiconductor
Jae-Yeol Kim,, Hyun-Jo Jeong,, Hun-Cho Kim,, Chang-Hyun Kim,Year:
2001
Language:
english
DOI:
10.1109/EMAP.2001.983997
File:
PDF, 868 KB
english, 2001