[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Application of Excel and thermal network method to thermal analysis of electronic equipment
Tomimura, Toshio, Ishizuka, MasaruYear:
2010
Language:
english
DOI:
10.1109/IMPACT.2010.5699476
File:
PDF, 344 KB
english, 2010