[IEEE 2008 Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) - Seoul, Korea (South) (2008.12.10-2008.12.12)] 2008 Electrical Design of Advanced Packaging and Systems Symposium - Module design using 2-layers PCB for an automotive BLDC motor driver
Chang-Gyun Kim,, Tae-Heon Lee,, Sang-Kook Kim,, Jin-Yong Jeon,, Jae-Kyung Wee,Year:
2008
Language:
english
DOI:
10.1109/EDAPS.2008.4736011
File:
PDF, 1.12 MB
english, 2008