[IEEE 2013 36th International Spring Seminar on Electronics Technology (ISSE) - Alba Iulia, Romania (2013.05.8-2013.05.12)] Proceedings of the 36th International Spring Seminar on Electronics Technology - Investigating copper wire bonding technology in Chip-on-Board applications
Krammer, Oliver, Roka, Peter, Jakab, LaszloYear:
2013
Language:
english
DOI:
10.1109/ISSE.2013.6648222
File:
PDF, 537 KB
english, 2013