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[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Simulation of deflection and stress for MEMS pressure sensor based on graphene
Jiang, Shengwei, Wang, Xuefang, Shi, Shuai, Yuan, Jiaojiao, Fang, Jing, Gao, Can, Liu, ShengYear:
2013
Language:
english
DOI:
10.1109/ICEPT.2013.6756513
File:
PDF, 395 KB
english, 2013