Time-dependent deformation behavior of interfacial...

Journal of Materials Research 2010 / 4 Vol. 25; Iss. 4

Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints

Song, Jenn-Ming, Su, Chien-Wei, Lai, Yi-Shao, Chiu, Ying-Ta
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Volume:
25
Language:
english
Journal:
Journal of Materials Research
DOI:
10.1557/JMR.2010.0081
Date:
April, 2010
File:
PDF, 1.09 MB
english, 2010
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