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[IEEE 2013 IEEE/MTT-S International Microwave Symposium - MTT 2013 - Seattle, WA, USA (2013.06.2-2013.06.7)] 2013 IEEE MTT-S International Microwave Symposium Digest (MTT) - Wireless chip-to-chip communication in three-dimensional integrated circuits using microbump antennas
Loke, Wing-Fai, Lu, Julia Hsin-Lin, Peroulis, Dimitrios, Jung, ByunghooYear:
2013
Language:
english
DOI:
10.1109/MWSYM.2013.6697411
File:
PDF, 362 KB
english, 2013