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[IEEE 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan (11-14 Dec. 2005)] 2005 International Symposium on Electronics Materials and Packaging - Characterization of Au-Sn Eutectic Die Attach Process for Optoelectronics Device
Tak-Seng, T., Decai Sun,, Huck-Khim Koay,, Sabudin, M., Thompson, J., Martin, P., Rajkomar, P., Haque, S.Year:
2005
Language:
english
DOI:
10.1109/EMAP.2005.1598246
File:
PDF, 5.83 MB
english, 2005