[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Study of copper barrel plating dissolution of printed circuit board with multiple exposure thermal stress testing
Jia-Xiong, Wu, Jin-Fei, ZhangYear:
2010
Language:
english
DOI:
10.1109/IMPACT.2010.5699467
File:
PDF, 204 KB
english, 2010