[IEEE 2013 IEEE 15th Electronics Packaging Technology...

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[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Graphene based heat spreader for high power chip cooling using flip-chip technology

Huang, Shirong, Zhang, Yong, Sun, Shuangxi, Fan, Xiaogang, Wang, Ling, Fu, Yifeng, Zhang, Yan, Liu, Johan
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Year:
2013
Language:
english
DOI:
10.1109/EPTC.2013.6745740
File:
PDF, 3.63 MB
english, 2013
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