Thermal Spreading Resistance and Heat Source Temperature in...

IEEE Transactions on Components Packaging and Manufacturing Technology 2013 / 11 Vol. 3; Iss. 11

Thermal Spreading Resistance and Heat Source Temperature in Compound Orthotropic Systems With Interfacial Resistance

Muzychka, Yuri S., Bagnall, Kevin R., Wang, Evelyn N.
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Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2013.2269273
Date:
November, 2013
File:
PDF, 3.63 MB
english, 2013
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