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[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Development of new TSV structure composing of intermetallic compounds
Daquan Yu,, Xiaoyang Liu,, Ran He,, Xiangmeng Jing,, Chongshen Song,, Fengwei Dai,, Yu Sun,, Lixi Wan,Year:
2012
Language:
english
DOI:
10.1109/EPTC.2012.6507108
File:
PDF, 775 KB
english, 2012