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[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Energy release rate investigation for through silicon vias (TSVs) in 3D IC integration
Hsieh, Ming-Che, Wu, Sheng-Tsai, Wu, Chung-Jung, Lau, John H., Tain, Ra-Min, Wei-Chung Lo,Year:
2011
Language:
english
DOI:
10.1109/ESIME.2011.5765764
File:
PDF, 3.26 MB
english, 2011