The use of laminate multichip modules for the packaging of...

IEEE Transactions on Advanced Packaging 2002 / 02 Vol. 25; Iss. 1

The use of laminate multichip modules for the packaging of 9-GHz digital multichip circuits

Schwab, D.J., Randall, B., Zabinski, P.J., Schaefer, T.M., Gilbert, B.K.
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Volume:
25
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/TADVP.2002.1017689
Date:
February, 2002
File:
PDF, 450 KB
english, 2002
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