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Properties enhancement of low Ag-content Sn–Ag–Cu lead-free solders containing small amount of Zn
El-Daly, A.A., Hammad, A.E., Al-Ganainy, G.S., Ragab, M.Volume:
614
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2014.06.009
Date:
November, 2014
File:
PDF, 3.13 MB
english, 2014