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The Changing Automotive Environment: High-Temperature Electronics
Johnson, R.W., Evans, J.L., Jacobsen, P., Thompson, J.R.R., Christopher, M.Volume:
27
Language:
english
Journal:
IEEE Transactions on Electronics Packaging Manufacturing
DOI:
10.1109/TEPM.2004.843109
Date:
July, 2004
File:
PDF, 1.51 MB
english, 2004