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[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Lead Free Micro Bumping - Cost & Yield Challenges
Ruhmer, Klaus, Hughlett, Emmett, Ishizuka, Masahiko, Kojima, Tomoaki, Asaka, Takeshi, Dang, Bing, Buchwalter, Steve, Shih, Da-YuanYear:
2007
Language:
english
DOI:
10.1109/EPTC.2007.4469694
File:
PDF, 804 KB
english, 2007