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The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi–Ag solder alloys
Spinelli, José Eduardo, Silva, Bismarck Luiz, Cheung, Noé, Garcia, AmauriVolume:
96
Language:
english
Journal:
Materials Characterization
DOI:
10.1016/j.matchar.2014.07.023
Date:
October, 2014
File:
PDF, 4.28 MB
english, 2014